IPC standards & acceptance
IPC-4554 addresses immersion tin plating. Specify the agreed edition and acceptance criteria; citing a standard is not a certification claim.
Build a quality checklist →FLAT PADS. THOUGHTFUL ENGINEERING.
Immersion tin PCB.
A better-informed
finish decision.
Explore white tin PCB technology—from copper preparation to assembly readiness. Understand the trade-offs, define your requirements, and start with the right questions.
THE SURFACE MAKES THE DIFFERENCEWhite tin. Fine detail.
01 / UNDERSTAND THE FINISH
What is an
immersion tin PCB?
A copper circuit board protected by a thin tin finish on its exposed copper features.
Often called white tin PCB, immersion tin uses a chemical displacement reaction rather than an externally applied plating current. The finish is applied to exposed copper; it does not make the solder mask white.
Explore white tin PCB terminology →01
Start with assembly requirements
Fine-pitch components, the soldering sequence and press-fit features need a board-specific finish review.
02
Plan the full storage journey
Packaging, handling and time before soldering matter. Confirm shelf life with the actual supplier and process.
03
Specify measurable acceptance
Agree on finish thickness, measurement method, solderability testing and the applicable specification revision.
02 / INSIDE THE PROCESS
A controlled process.
Not just a coating.
01 — Prepare the copper
Cleaning and controlled surface preparation establish the condition needed for consistent deposition. Residue or poor rinsing can affect later steps.
02 — Deposit the tin
A controlled chemical bath deposits tin on exposed copper. Chemistry, temperature and treatment time follow the qualified process, not a universal recipe.
03 — Rinse, dry and inspect
Rinsing and drying control residual chemistry. Inspect coverage and verify the specified finish properties using agreed methods and sampling.
04 — Package for the next operation
Protect boards from contamination and handling damage. Record the finish date, packaging condition and storage instructions before assembly.
03 / CHOOSE WITH CONTEXT
| Selection factor | Immersion tin | ENIG | HASL |
|---|---|---|---|
| Surface approach | Tin on copper | Nickel with a thin gold finish | Solder coating, leveled with hot air |
| Planarity | Planar finish | Planar finish | Less uniform on small pads |
| Engineering focus | Available tin, storage, thermal history | Nickel integrity and finish control | Pad geometry and leveling |
| Before selection | Validate intended assembly sequence | Review application compatibility | Review fine-pitch requirements |
For additional background, review this immersion tin surface finish guide and an overview of ENIG PCB finishes.
04 / ENGINEERING DECISION AID
Turn your constraints
into better questions.
Select your assembly and storage conditions. This tool prepares discussion points for a finish review; it does not certify a design or predict service life.
YOUR REVIEW CHECKLIST
Confirm the complete assembly window.
Request the qualified soldering profile, handling guidance and solderability acceptance criteria.
Record the finish date and maintain the supplier's packaging conditions until use.
Bring these questions to your inquiry ↗05 / QUALITY & APPLICATIONS
Go beyond a finish name.
From prototype to assembly
Link surface finish decisions to pad geometry, soldering, handling and test requirements throughout your build.
Explore application considerations →Practical engineering guides
Find focused explanations of process control, storage, finish comparisons and procurement requirements.
Visit the knowledge center →06 / START WITH YOUR PROJECT
Let’s talk about
your next PCB.
Share your board requirements and the questions you need answered.
Include the intended application, assembly sequence, quantity and target date when available. You can request an NDA discussion before sharing drawings.
Attachments are optional. Supported formats and limits appear in the form.